Copper Foil
Overview
MEI rolls thin-gauge copper foil down to 0.04 mm for applications where conductivity, formability, and uniform thickness are critical. Produced on precision rolling mills with rigorous inline gauge control, our foil offers a smooth, clean surface free of slivers and edge burrs — essential for winding, shielding, and laminating operations.
SIZE RANGE
| Parameter | Min | Max |
|---|---|---|
| Thickness | 0.04 mm | 0.50 mm |
| Width | 10 mm | 406 mm |
| Supply Form | Coils — traverse-wound or pancake | - |
GRADES OFFERED
| MEI Grade | Alloy / Common Name | Cu (%) | Key Element | India IS | ISO | USA ASTM | Japan JIS | UK BS |
|---|---|---|---|---|---|---|---|---|
| MEI-115 | Commercial Copper | Rem. (Zn: 0.1–1.0%) | Other ≤0.10%, P ≤0.02% | — | — | — | — | — |
| MEI-110 | ETP Electrolytic Tough Pitch | ≥99.90 | O: 0.005–0.040% | IS 191/1897 | Cu ETP | C11000 | C1100 | C101 |
| MEI-120 | DLP Deox. Low Phosphorus | ≥99.90 | P: 0.005–0.013% | IS 191 | Cu-DLP | C12000 | C1201 | — |
| MEI-122 | DHP Deox. High Phosphorus | ≥99.90 | P: 0.015–0.040% | IS 191/14811 | Cu DHP | C12200 | C1220 | C106 |
| MEI-144 | TBC Tin-Bearing Copper | ≥99.50 | Sn: 0.070–0.200%, P: 0.015–0.045% | IS 3331 | Cu TBC | C14410 | — | — |
TEMPER REFERENCE
| Temper | VPN (Vickers Hardness) |
|---|---|
| Soft | 45 – 60 |
| HA (Quarter Hard) | 60 – 75 |
| HB (Half Hard) | 75 – 90 |
| HD (Full Hard) | 90 – 110 |
| AR (As Rolled) | >110 |
APPLICATIONS
Transformer and coil windings, EMI/RFI shielding, flexible connectors, earthing tapes, gaskets, capacitors, radiator fin stock (TBC), craft and decorative work, and
electrical laminations.
WHY MEI
Thin-gauge rolling down to 0.04 mm is a specialist capability — our mills hold tolerance at foil gauges that many general rolling mills cannot, with full traceability
from cast bar to finished coil.