MEI 144
Overview
MEI-144 (Cu-TBC) is tin and phosphorus co-doped copper (76% IACS) with improved softening resistance at elevated temperatures. Not susceptible to
hydrogen embrittlement. Ideal for semiconductor components, connectors and terminals requiring thermal stability.
| CHEMICAL COMPOSITION (wt. %) | ALLOY DESIGNATIONS | COIL / SHEET SPECIFICATIONS | |||
|---|---|---|---|---|---|
| Element | Composition (%) | Standard | Designation | Specification | Range |
| Cu | ≥99.500 (Min.) | IS | IS 3331 | Thickness (mm) | 0.04 – 3.0 |
| P | 0.015 – 0.045 | JIS | — | Width (mm) | 6.00 – 406 |
| Sn | 0.070 – 0.200 | ISO | Cu TBC | Inner Dia. (mm) | 100 / 150 / 200 / 300 / 400 / 500 |
| ASTM | C14410 | Coil Wt. (kg/mm) | 1.0 – 4.0 | ||
| BS | — | Sheet Length (m) | 0.50 – 4.00 | ||
| MECHANICAL PROPERTIES — typical values at 20°C | |||||
|---|---|---|---|---|---|
| Temper | Code | HV | Tensile MPa | Yield MPa | Elongation % (min) |
| Annealed | O | 40–60 | 200–250 | ≤100 | 25 |
| 1/4 Hard | HA | 60–80 | 250–300 | ≤140 | 20 |
| 1/2 Hard | HB | 80–100 | 300–360 | ≥270 | 10 |
| Hard | HD | 105–125 | 360–430 | ≥310 | 7 |
| Extra Hard | EH | ≥125 | ≥430 | ≥410 | 4 |
| PHYSICAL PROPERTIES — annealed temper at 20°C | ||||
|---|---|---|---|---|
| Density (g/cm³) | Elec. Conductivity (% IACS) | Thermal Conductivity (W/m·K) | Modulus of Elasticity (GPa) | Specific Heat (J/kg·K) |
| 8.94 | 76 | 330 | 120 | 385 |
| FABRICATION PROPERTIES | |||
|---|---|---|---|
| Fabrication Property | Rating | Fabrication Property | Rating |
| Capacity for Cold Working | Excellent | Soft Soldering | Excellent |
| Machinability | Less suitable | Resistance Welding | Less suitable |
| Electroplating | Excellent | Gas Shielded Arc Welding | Excellent |
| Hot Dip Tinning | Excellent | Laser Welding | Good |
CORROSION RESISTANCE
MEI-144 is generally less subject to corrosion than other engineering metals. Resistant to industrial atmosphere, industrial and drinking water (max flow 4.5–6.0 ft/s), pure water vapour, non-oxidizing acids, alkalis (except ammonia/cyanide) and neutral saline solutions. Not resistant to oxidizing acids, hydrous ammonia, halogenated gases or seawater at high flow rates.
| TYPICAL APPLICATIONS | |
|---|---|
| • Heat exchangers and thermal management | • Transistors and semiconductor components |
| • Mineral insulated cables | • Connectors, terminals and strip for plating |